Advanced process equipment for semiconductor research and fabrication — from wafer characterization and thin-film deposition to lithography and plasma processing.
Creation Engineerings offers a comprehensive range of semiconductor assembly and process equipment suitable for research labs, universities, pilot production lines and advanced manufacturing facilities. Our equipment portfolio covers the full wafer processing workflow from substrate preparation through to final thickness characterization.
High-precision manual and semi-automatic probe stations for electrical characterization of semiconductor wafers, dies and devices. Supports 4-inch to 8-inch wafers with sub-micron probe placement accuracy.
Enquire NowPVD/CVD thin-film deposition systems for depositing metals, dielectrics and semiconducting layers. Configurable for thermal evaporation, e-beam evaporation or sputtering processes.
Enquire NowALD systems for conformal deposition of ultra-thin dielectric and metal films with atomic-level thickness control. Ideal for high-k gate dielectrics, barrier layers and encapsulation films.
Enquire NowRIE systems for anisotropic dry etching of silicon, dielectrics and metals. Suitable for patterning with photoresist masks, producing high aspect ratio structures with excellent etch selectivity.
Enquire NowBenchtop and load-lock plasma cleaning systems for surface activation, photoresist descumming and organic contamination removal from wafers, substrates and bonding surfaces.
Enquire NowProgrammable spin coating systems for uniform deposition of photoresists, sol-gel films and polymer coatings on wafers and substrates. Variable speed and acceleration control for film thickness optimization.
Enquire NowDirect-write laser lithography systems for maskless patterning. Suitable for prototyping, MEMS fabrication and custom photomask production with micron-level resolution.
Enquire NowUV contact and proximity mask aligners for photolithography patterning. Supports front-side and back-side alignment with submicron overlay accuracy for multi-layer device fabrication.
Enquire NowOptical and contact-based film thickness measurement systems for in-process and final quality control. Measures thin films from a few nanometers to several micrometers with high repeatability.
Enquire NowOur semiconductor equipment specialists can help you select and configure the right process equipment for your specific application — from R&D pilot lines to small-scale production. We also provide installation, commissioning and operator training.
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