The atmospheric pressure plasma cleaner generates a stable plasma jet (or diffuse discharge) at ambient pressure using air, nitrogen, argon, or oxygen as the working gas. It removes organic contamination, oxides, and surface passivation layers while simultaneously activating surfaces for improved adhesion of adhesives, coatings, and underfills — without the need for vacuum pumping equipment.

• No vacuum required
• Inline production integration
• Fast throughput processing
• Selective area treatment
• Robot arm mountable head
• Multiple nozzle configurations
• Dry, chemical-free process
• UV ozone option available

The low pressure plasma cleaning system operates under vacuum (0.1 – 100 Pa) with RF or microwave power excitation. Under reduced pressure, the plasma mean free path is extended — enabling thorough surface cleaning of complex 3D geometries, recesses and vias. The system processes batches of PCBs, wafers, MEMS, medical devices and precision components with superior cleaning uniformity and process repeatability.

• Full 360° surface treatment
• High-aspect ratio cleaning
• Mass flow controller gas mixing
• Precise process repeatability
• Quartz or metal chamber options
• Auto pressure regulation
• RF impedance matching
• 21 CFR Part 11 data logging