Atmospheric Pressure Plasma Cleaning System
Atmospheric Pressure Plasma Cleaner
Inline and batch surface cleaning & activation without vacuum
The atmospheric pressure plasma cleaner generates a stable plasma jet (or diffuse discharge) at ambient pressure using air, nitrogen, argon, or oxygen as the working gas. It removes organic contamination, oxides, and surface passivation layers while simultaneously activating surfaces for improved adhesion of adhesives, coatings, and underfills — without the need for vacuum pumping equipment.
- No vacuum required
- Inline production integration
- Fast throughput processing
- Selective area treatment
- Robot arm mountable head
- Multiple nozzle configurations
- Dry, chemical-free process
- UV ozone option available
AirN₂ (Nitrogen)O₂ (Oxygen)Ar (Argon)He (Helium)
Low Pressure Plasma Cleaning System
Low Pressure / Vacuum Plasma Cleaner
Batch processing under controlled vacuum for deep surface treatment
The low pressure plasma cleaning system operates under vacuum (0.1 – 100 Pa) with RF or microwave power excitation. Under reduced pressure, the plasma mean free path is extended — enabling thorough surface cleaning of complex 3D geometries, recesses and vias. The system processes batches of PCBs, wafers, MEMS, medical devices and precision components with superior cleaning uniformity and process repeatability.
- Full 360° surface treatment
- High-aspect ratio cleaning
- Mass flow controller gas mixing
- Precise process repeatability
- Quartz or metal chamber options
- Auto pressure regulation
- RF impedance matching
- 21 CFR Part 11 data logging
O₂ArH₂ / Forming GasCF₄N₂SF₆
Atmospheric vs Low Pressure — At a Glance
Atmospheric Pressure
- No vacuum chamber needed
- Fast inline processing
- Robot & conveyor integration
- Lower capital investment
- Best for flat surfaces & spot treatment
- Immediate substrate handling after process
Low Pressure
- Superior uniformity across batch
- Deep cleaning of vias and recesses
- Ideal for wafers and MEMS
- Precise gas mixture control
- Reactive ion etching (RIE) capability
- FDA/ISO compliant data logging
Application Areas
| Industry | Application | Recommended Type |
|---|---|---|
| PCB / Electronics | Pre-soldering activation, flux removal, underfill prep | Atmospheric or Low Pressure |
| Semiconductor | Wafer cleaning, photoresist strip, native oxide removal | Low Pressure |
| Automotive | Bonding surface prep, gasket & adhesive activation | Atmospheric |
| Medical Devices | Implant sterilisation, hydrophilisation, biocompatibility | Low Pressure |
| Aerospace | Composite surface prep, adhesive bonding pre-treatment | Low Pressure |
| Optics | Lens cleaning, anti-reflection coating prep | Low Pressure |
| MEMS | Release layer removal, hydrophobic/hydrophilic switching | Low Pressure |
| Plastics / Polymers | Surface energy increase for printing, painting, bonding | Atmospheric |