Atmospheric pressure and low-pressure plasma cleaning systems for surface activation, oxide removal, degreasing, and pre-treatment of PCBs, semiconductor wafers, metals, polymers, and composites.
Inline and batch surface cleaning & activation without vacuum
The atmospheric pressure plasma cleaner generates a stable plasma jet (or diffuse discharge) at ambient pressure using air, nitrogen, argon, or oxygen as the working gas. It removes organic contamination, oxides, and surface passivation layers while simultaneously activating surfaces for improved adhesion of adhesives, coatings, and underfills — without the need for vacuum pumping equipment.
Batch processing under controlled vacuum for deep surface treatment
The low pressure plasma cleaning system operates under vacuum (0.1 – 100 Pa) with RF or microwave power excitation. Under reduced pressure, the plasma mean free path is extended — enabling thorough surface cleaning of complex 3D geometries, recesses and vias. The system processes batches of PCBs, wafers, MEMS, medical devices and precision components with superior cleaning uniformity and process repeatability.
| Industry | Application | Recommended Type |
|---|---|---|
| PCB / Electronics | Pre-soldering activation, flux removal, underfill prep | Atmospheric or Low Pressure |
| Semiconductor | Wafer cleaning, photoresist strip, native oxide removal | Low Pressure |
| Automotive | Bonding surface prep, gasket & adhesive activation | Atmospheric |
| Medical Devices | Implant sterilisation, hydrophilisation, biocompatibility | Low Pressure |
| Aerospace | Composite surface prep, adhesive bonding pre-treatment | Low Pressure |
| Optics | Lens cleaning, anti-reflection coating prep | Low Pressure |
| MEMS | Release layer removal, hydrophobic/hydrophilic switching | Low Pressure |
| Plastics / Polymers | Surface energy increase for printing, painting, bonding | Atmospheric |